1 Oct 2013
DSM makes breakthrough in polyamide blown film processing with Akulon XS
Royal DSM, the global Life Sciences and Materials Sciences company, says the potential for polyamide 6 in blown film for flexible food packaging is further enhanced with the introduction of Akulon® XS. Thanks to its improved crystallisation properties, Akulon XS has an extended processing window, providing new opportunities in designing co-extruded multi-layer as well as monolayer film structures. Processors notice significant improvements in production when using the new Akulon XS.
25 Sept 2013
DSM to exhibit innovations at GIE+EXPO
DSM will highlight its high-performance engineering plastic solutions for outdoor power equipment (OPE) manufacturers during the GIE+EXPO, October 23-25 at the Kentucky Exposition Center in Louisville, KY (Booth #9023).
19 Sept 2013
DSM and Ravago partnership introduces portfolio of recycled PA compounds
Royal DSM, the global Life Sciences and Materials Sciences company, has announced that it has expanded its partnership with the Ravago Group, a leader in distribution, resale, compounding and recycling of plastic and elastomeric raw materials. The two companies have combined DSM’s expertise in polyamide 6 with Ravago’s recycling know-how to develop a portfolio of glass reinforced recycled PA6 compounds. The materials will be offered by DSM directly and distributed by Ravago Group member Resinex, which has a leading position in the plastics and rubbers distribution market across Europe and Turkey, and which is already a well-established distributor of DSM engineering plastics.
10 Sept 2013
DSM launches solutions in advanced thermoplastic composites for lighter and more sustainable automotive applications
Royal DSM, the global Life Sciences and Materials Sciences company, is launching a custom-made solution for structural and semi-structural applications, incorporating various types of continuous fiber reinforcements embedded in its advanced polyamides. Together with several industry partners, DSM has developed advanced thermoplastic composites, which are initially aimed at the automotive industry.
4 Sept 2013
DSM to showcase sustainable innovations in engineering plastics at K2013
Royal DSM, the global Life Sciences and Materials Sciences company, will present at K2013 (16-23 October in Dusseldorf, Germany) sustainable and innovative solutions that address key global challenges like climate change. With a portfolio of high performance plastics for applications in automotive, electrical and electronics, flexible food packaging, and consumer goods, the company is committed to do everything it can to contribute to a more sustainable world. DSM will be on Stand 11 in Hall 6B.
2 Sept 2013
DSM and KACO cut weight and costs with crankshaft cover made in EcoPaXX polyamide 410 for next-generation Volkswagen engines
Royal DSM, the global Life Sciences and Material Sciences Company, together with its automotive component specialist partner KACO, has taken an important step in improving fuel efficiency in cars. The two companies have developed a lightweight multi-functional crankshaft cover in EcoPaXX®, DSM's bio-based polyamide 410, for the latest generation of diesel engines developed by the Volkswagen Group.
20 Aug 2013
DSM's Stanyl ForTii enables LOTES breakthrough in memory connectors for servers
The leading Taiwanese memory connector manufacturer LOTES Co., Ltd. has selected DSM's Stanyl® ForTii™ H11 polyamide 4T for housings for a new range of connectors for the next generation of computer memories, known as DDR4. These connectors will meet OEM design needs in a range of devices, including servers, desktops, and voice gateways.
20 Aug 2013
DSM's high performance Stanyl ForTii polyamide is key to LOTES DDR4 memory connector breakthrough
The leading Taiwanese memory connector manufacturer LOTES Co,, Ltd. has selected DSM's Stanyl® ForTii™ H11 polyamide 4T for housings for a new range of DDR4 connectors. T/H type and also SMT, Single-latch, VLP, ULP and Press-fit types will meet OEM design needs in servers, desktops, complex base station and voice gateways. The housings are suitable for wave and infrared reflow soldering, and are available in various colors.
13 Aug 2013
DSM and Cicor improve access security in banking industry with Stanyl ForTii
Royal DSM, the global Life Sciences and Material Sciences company, announces a breakthrough for the use of Stanyl ForTii, its high performance polyamide 4T, in three-dimensional molded interconnect devices, 3D-MIDs in the field of data security in banking. The robust plating performance of Stanyl ForTii combined with its high strength & stiffness at elevated temperatures, give designers the freedom to condense their designs.
31 Jul 2013
DSM says change to UL standard will boost its engineering plastics in electrical applications
Royal DSM, the global Life Sciences and Materials Sciences company, says a recent change to an Underwriters Laboratory (UL) standard covering low-voltage switchgear (LVSG) has opened up the way for plastics innovation in electrical applications such as miniature circuit breakers. The company is leading the conversion from thermosets to engineering thermoplastics for LVSG applications. With its broad portfolio of high-performance halogen-free flame-retardant solutions DSM offers a cost-effective alternative for thermosets in these safety-critical, highly demanding technical applications.
25 Jul 2013
DSM's Stanyl ForTii used in exhaust gas recirculation temperature sensors
Royal DSM, the global Life Sciences and Material Sciences company, says a new generation of automotive exhaust gas recirculation temperature (EGRT) sensors is now being made in its Stanyl® ForTii™ high performance polyamide 4T. Thanks to the very high temperature stability of Stanyl ForTii, costs are being cut in the production of the sensors, without compromising on quality.
22 Jul 2013
DSM's Stanyl ForTii proven for next generation DDR-DIMM sockets
Royal DSM, the global Life Sciences and Materials Sciences company, says its Stanyl® ForTii™ is the only halogen free, high temperature polyamide that answers the stringent requirements of reflow soldering for DDR3sockets, as well as the demand for high flow. It also offers extremely low warpage after reflow.
