STANYL FORTII USED IN MEMORY CARD CONNECTORS FOR PRINTERS

Taisol Electronics, the second largest Taiwanese memory card manufacturer with branch offices in China, Singapore, Japan, USA and worldwide distribution, has commercialized halogen-free V-0 Stanyl® ForTii™ for its 5-in-1 memory card socket, readily usable for Memory StickTM, SD CardTM, MMCTM, Smart MediaTM, and xD-Picture CardTM. These 5-in-1 memory card connectors are already used in printers produced by one of the leading top two OEMs. Such memory card connectors are a central interface in today’s Electronics. Applications include Notebooks, Desktop PCs, Card readers, LCD Projectors, Monitors, etc.

Taisol was looking for an improved material that could reduce warpage in their 5-in-1 memory card connectors. Although the previous solution, a GFR PA9T was specifically developed as a low warpage grade, Stanyl ForTii F31 could reduce warpage by an astonishing 50% in comparison.

Amin Hsu, Assistant General Manager at Taisol Electronics China says: “TaiSol Electronics’ expertise is in design and manufacturing of electronics thermal cooling and flash media connector solutions. For our 5-in-1 memory cards we have selected Stanyl ForTii and we are currently looking to expand the material to other product lines as well. Thanks to its high stiffness and related excellent low warpage properties after reflow, we were not only able to fulfill our customers’ requirement for a flame retardant, reliable card connector, but could also offer an entirely halogen free solution while reducing their total cost. Access to Stanyl ForTii and the strong application support of DSM Engineering Plastics will help us to further strengthen our position and increase our global position.”

Ong See Wee, Senior Application Development Manager DSM Engineering Plastics in Asia, who worked intensively with Taisol, comments:“Such a dramatic improvement in coplanarity versus competitor materials is a significant improvement to our customers. With growing integration, density in Electronics warpage has become one of the biggest issues for manufacturers. Particularly warpage after reflow is a major challenge since the stiffness of most materials drops sharply at such elevated temperatures during lead free reflow soldering. ForTii has been developed to keep a high stiffness even at elevated assembly temperatures above 300°C. ForTii drastically improves warpage yield loss and is outperforming any other Polyamide as well as PPS and LCP. The unique properties of ForTii are also helping manufacturers to reduce their manufacturing costs whilst at the same time, advancing product performance to another level, enabling manufacturers to retain their competitive edge".

Chris Tseng and Aaron Lin, Business Development Managers at DSM Engineering Plastics in China and Taiwan add: “The ForTii F31 grade was developed as a low warpage, halogen free UL94-V0 grade for memory card connectors and similar applications requiring high coplanarity and little change after reflow. With the increase of coplanarity our tier1 customers as well as electronic manufacturers can reduce their inspection and rework cost significantly.”

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