Dow Corning showcases new, advanced products at Electronica & Productronica 2005 show

Mar 15, 2005 Shanghai Dow Corning¡¯s, electronics and advanced technologies businesses used the Electronica & Productronica 2005 show, Mar 15-17 Shanghai, to demonstrate their latest product and technology advancements. The show attracted a high degree of interest and visitors to Dow Corning¡¯s booth reinforcing the company¡¯s leading position as a materials, technology and service supplier to the electronics industry.

For more than 60 years, Dow Corning has been a global leader and innovator of silicones and silicon-based technologies, developing advanced material solutions that have enhanced the performance and functionality of electronic products and contributed to their customers¡¯ business success.

To further this business strategy, Dow Corning introduced an External Equipment Provider Alliance in 2004, which leverages member companies¡¯ expertise to simplify the procurement, integration, start-up and optimization of materials and processing equipment for customers. One of the first developments to result from this alliance, was a new thermally conductive encapsulant¡ªDOW CORNING® SE 4451 which was launched in 2004. Designed for highly demanding heat-management performance in electronic power devices, DOW CORNING SE 4451 offers a unique combination of high thermal conductivity and low viscosity. The material¡¯s properties enable fast dispensing and cure times, thereby reducing costs in volume manufacturing.

In last October, Dow Corning also launched two other thermally conductive materials¡ªDOW CORNING® SE 4447 CV and the SE 4448 CV thermally conductive dispensable pad. These new products are designed primarily for applications in the automotive market such as heat management in brake systems, seat controllers and cooling fan modules.

Moreover, Dow Corning marked its most significant step-change in 2004 as well: a move into the US$ 1 billion specialty organics market with PI-2000, a breakthrough conductive ink specifically designed for today¡¯s increasingly diverse and demanding electronics manufacturing applications. Additionally the company introduced a number of new products: PI-2200, PI-2310, PI-2320, PI-2500, PI-2600 to address the wide range of performance requirements in silver ink applications. Dow Corning¡¯s materials deliver a step change in conductive ink performance, with greater conductivity than other products in the market and the ability to maintain low resistivity even during long-term environmental stress.

In 2005, Dow Corning will continue to advance their business strategy for the electronics market and develop new materials for the market. ¡°Dow Corning¡¯s aim is to always provide our customers with the complete materials offering that provide the highest performance levels coupled with unparalleled technical and customer support. We will continue to develop our materials¡¯ technology, launching new products, and working together with our customers to to assist in their own product development,¡± said Tom Cook, global industry executive director, Dow Corning.

Reader enquiries