TE Connectivity, ifm, SAP and the OPC Foundation to Present Test Platform for Transmitting and Evaluating Sensor Data in IT Systems at the Hanover Fair

DARMSTADT, Germany – April 25, 2016 – TE Connectivity (TE), a world leader in connectivity and sensors, has collaborated with ifm, SAP and the OPC Foundation to develop a test bed that shows how all sensor data can be transmitted from machines to an IT system and evaluated there. This allows the efficiency of a factory to be considerably enhanced through, for example, a reduction in energy consumption. Because the solution is easy to retrofit in virtually any production facility, it significantly increases productivity and improves resource efficiency. The partners developed the test bed within the Industrial Internet Consortium (IIC).

The four partners will present an application for the test bed from the field of plastics processing at this year's Hanover Fair at the ifm booth (Hall 9, Booth D36). They will demonstrate how energy consumption can be reduced through optimum regulation of the air flow for drying material used in the process.

Smart processes require comprehensive information from the sensors. "The necessary data is frequently available via the sensors, but the controllers generally only process a fraction of what is available," says Dr. Myriam Jahn, managing director, ifm datalink GmbH. With the solution presented at the exhibition, it is now possible to have all sensor data transferred to IT systems without needing to reprogram the controller.

This new solution makes it possible to use data in numerous ways; for example, for condition monitoring, to monitor energy consumption, or to ensure the quality of manufactured products through their seamless traceability. Not only can the efficiency of the processes be improved as a result, but the implementation of energy management processes such as ISO 50001 is also supported at the same time.

The test platform covers the entire infrastructure required for connecting machine sensors to IT systems. Data communication takes place via IO-Link, OPC UA and Profinet. "Our contribution lies essentially in using smart connectivity technology to connect various communication protocols and architectures that exist at the different levels to ensure a smooth flow of information from field level to the cloud," explains Monika Kuklok, senior manager, Innovation Platforms & Ventures at TE Connectivity. "Due to the cooperation within the IIC, we have once more demonstrated TE's expertise in the field of intelligent solutions for future industrial data communications."

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