TE Connectivity Extends Industrial Mini I/O Connector Portfolio with Surface-Mount PCB Header

DARMSTADT, Germany – December 15, 2016 – TE Connectivity (TE), a world leader in connectivity and sensors, is upgrading its portfolio of industrial mini I/O connectors with the addition of a surface-mount PCB header. Its co-planarity of just 0.08mm enables the amount of paste to be minimized during assembly. Because of this, the surface-mount PCB header delivers best-in-class solderability.

The use of high temperature resistant liquid crystal plastic (LCP) for the housing provides resistance to higher reflow soldering temperatures. This increases processing efficiency and extends the durability of the header. In addition, by improving the electrical performance in terms of EMI shielding and signal integrity, the industrial mini I/O PCB header is ready for future system upgrades up to CAT6A performance classes.

The PCB header incorporates all the benefits of existing industrial mini I/O connectors, such as compact size, vibration resistance for industrial environments, ease of use, and durability, and conforms to the latest requirements of industrial assembly processes.

“With this new surface-mount technology (SMT) PCB header, we have taken an important step in establishing the industrial mini I/O connector range as the leading rugged, compact and future-proof I/O connector system for demanding industrial applications,” says Ruud van den Brink, product manager for TE’s Automation and Control business unit.

TE also offers cable assemblies for the mini I/O connectors. These come in a variety of cable versions, including an industrial RJ45-to-mini I/O assembly. They support design flexibility across a broad range of application needs, from providing protection in harsh environments to allowing for the use of highly flexible cables inside the cabinet.

For more information please visit www.te.com/products/mini-io.

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