Electrical
The companies featured on PressReleaseFinder are active in several industries.
27 Apr 2021
SABIC debuts a novel bio-based LNP™ compound that can help reduce carbon emissions and fossil fuel use
SABIC today launched new bio-based LNP™ THERMOCOMP™ DC0041PE-7M1D145W compound, offering customers a new sustainable option for demanding applications in electrical/electronics, healthcare and other key industries. This new flame-retardant, carbon fiber-reinforced compound has a reduced carbon/energy footprint compared to its incumbent product, LNP THERMOCOMP DC0041PE-7M1D145 compound, while delivering the same properties.
3 Mar 2021
Belden’s HiOS Software Upgrade Designed to Meet the Needs of Industry 4.0
Belden Inc. (NYSE: BDC), a leading global supplier of specialty networking solutions, has released the latest version of its Hirschmann Operating System (HiOS). Complete with an embedded Open Platform Communications Unified Architecture (OPC UA) server, the software provides a seamless, brand-agnostic solution as industrial automation moves towards Industry 4.0. Belden is the only manufacturer to offer switches that can natively run this communication protocol.
Belden Inc. (NYSE: BDC), a leading global supplier of specialty networking solutions, has released its Hirschmann BOBCAT High-Port Switch, the newest addition to the growing BOBCAT family. This managed switch, with up to 24 ports, offers a compact yet powerful networking solution for the Industrial Internet of Things (IIoT).
Royal DSM, a global science-based company in Nutrition, Health and Sustainable Living, today announced that it will start a strategic partnership with Neste, the world’s leading producer of renewable diesel and sustainable aviation fuel and a forerunner as provider of renewable and circular solutions for the chemical industry, to enable the production of high performance polymers. This enables DSM and its customers to reduce the carbon footprint of their own products whilst supporting the industry to transition to a circular economy.
Like 3G, 4G and the wireless standards that went before, 5G promises to bring us another leap in communication and connectivity - and this time a particularly huge one. Phones will be able to download whole 4k movies in seconds, and streaming becomes ultra-smooth. Augmented reality will help us with our shopping decisions, cars, robots and factories fully connect, and doctor's visits become possible from a 1,000 miles away.
TE Connectivity (TE), a world leader in connectivity and sensors, is freeing up valuable space on printed circuit boards (PCBs) for design engineers with its new compact AMPMODU wire-to-board receptacles with crimp contacts and shrouded headers. With centerline distances of 2 mm, they occupy 38 percent less space on a PCB than connectors with a 2.54 mm [0.100”] centerline.