Engineering
The companies featured on PressReleaseFinder are active in several industries.
1 Jun 2021
Henkel’s Technomelt Low Pressure Molding technology meets latest demands for encapsulation of electronics and medical components
Henkel’s Low Pressure Molding technology for encapsulating electrical and electronic components in its Technomelt polyamide adhesive molding compounds is increasingly being adopted for medical, electronic components, power and industrial automation, HVAC and lighting applications. The technology offers numerous economic, process control, design and environmental advantages over alternative systems such as potting with reactive resin systems and high-pressure injection molding.
4 May 2021
Innovative collaboration: award for jointly developed component
Collaboration between an automobile manufacturer headquartered in Southern Germany and KRAIBURG TPE has resulted in the creation of an outstanding solution. Future-oriented, sustainable and efficient, the new material was developed in close cooperation with the OEM and is now moving into series production.
Royal DSM, a purpose-led, global science-based company active in Nutrition, Health and Sustainable Living, is launching a new portfolio of engineering materials designed to help global medical device manufacturers improve the quality of care for patients around the world.
Belden Inc. (NYSE: BDC), a leading global supplier of specialty networking solutions, has released the latest version of its Hirschmann Operating System (HiOS). Complete with an embedded Open Platform Communications Unified Architecture (OPC UA) server, the software provides a seamless, brand-agnostic solution as industrial automation moves towards Industry 4.0. Belden is the only manufacturer to offer switches that can natively run this communication protocol.
Belden Inc. (NYSE: BDC), a leading global supplier of specialty networking solutions, today announced that it has entered into a definitive agreement to acquire privately held OTN Systems N.V., a leading provider of automation networking infrastructure solutions, for approximately $71 million, net of cash acquired. The transaction is expected to close in the first quarter 2021, subject to customary closing conditions, and will be financed with cash on hand, which was approximately $500 million at the end of 2020. Separately, the Company increased its revenue and EPS guidance for the fourth quarter 2020.
Belden Inc. (NYSE: BDC), a leading global supplier of specialty networking solutions, has released its Hirschmann BOBCAT High-Port Switch, the newest addition to the growing BOBCAT family. This managed switch, with up to 24 ports, offers a compact yet powerful networking solution for the Industrial Internet of Things (IIoT).